Celsia NanoSpreaders™ were developed with one simple goal in mind: cool today's silicon chips, LEDs, LCDs, and other electronic components better than any other technology in its price band.

The goal is realized through a patented copper encased two-phase vapor chamber that is thin (from 1.5mm), light, and delivers up to 30% lower thermal resistance (better cooling) than heat pipes when used as part of a total cooling solution.

NanoSpreaders™ can be attached directly to single or multiple heat sources, simplifying cooling solution design, and are an excellent means of transporting heat over a long distance. They can be easily shaped and integrated with complementary cooling components such as fins and fans and can even be affixed to an enclosure wall to maximize heat dissipating surface area.