Celsia Nanospreaders™ can be made into a wide range of design configurations
1. Bent or Stepped: Using a nominal 10mm bend radius, Nanospreaders™ can have bends that span a range from simple offsets to complex
Heat Pipe Alternative: Embossed Vapor Chamber #1 |
Heat Pipe Alternative: Embossed Vapor Chamber #2 |
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2. Embossed: A common design requirement when the heat source is recessed. A typical embossment dimensions is 25mm x 25mm x 0.5mm high. The backside of the Nanospreader™ remains flat for optimal connection to the fin stack
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| Heat Pipe Alternative: Embossed Vapor Chamber #1 |
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Vapor Chamber Solutions for Graphics Cards
3. Used as part of a fin array: stamped fin arrays are soldered directly to the vapor chamber to assure a robust thermal and mechanical attachment while large extruded arrays use thermally conductive epoxy.
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| 7mm tall, low profile assembly with aluminum finsHeat Pipe Alternative: Vapor Chamber with Fins #1 |
1U Server copper fin stack soldered to a mounting frame and Nanospreaders™Heat Pipe Alternative: Vapor Chamber with Fins #2 |

250mm x 350mm extruded fin array using epoxy to attach four Nanospreaders™
Heat Pipe Alternative: Vapor Chamber with Fins #3