Dr. Avram Bar-Cohen

Dr. Bar-Cohen began his professional career at the Raytheon Company in Massachusetts in 1968 and since then has been involved in the design, analysis, and optimization of thermal systems, with emphasis on the thermal packaging of electronic equipment. He has lectured widely, published extensively in the archival heat transfer and packaging literature, and taught many Short Courses on this subject, both at universities and major conferences in the US and abroad. He is a Fellow of ASME and of IEEE and serves as the Editor of the IEEE Transactions on Components and Packaging Technologies. Today, he serves as a Distinguished University Professor and Chair within the department of Mechanical Engineering for the University of Maryland.

Prof. Bar-Cohen served as General Manager and Executive Consultant for packaging and physical modeling at Control Data Corporation, 1984-1989, held a succession of academic appointments, from Lecturer to Professor, in the Department of Mechanical Engineering at the Ben Gurion University of the Negev (Israel), 1973-1988, held the Sweatt Chair in Technological Leadership at the University of Minnesota, where he also served as the Director of the Center for the Development of Technological Leadership from 1997 to 2002 and Professor of Mechanical Engineering from 1992 to 2002.

In the past he also held faculty positions at the Massachusetts Institute of Technology, 1977-1978, and the Naval Postgraduate School, 1982. In 1988 Prof. Bar-Cohen was the founding chairman of the ASME/IEEE Intersociety Conference on Thermal Phenomena in Electronic Systems (ITHERM) and chaired the 2nd ITHERM Conference in 1990. Among other responsibilities, he served as the General Chairman for the first InterPack (International Intersociety Packaging Conference) in 1995; chaired the International Advisory Committee of the 1997 Electronic Packaging Technology Conference in Singapore, and was Chairman of the International Conference on Heat Exchangers for Sustainable Development, June 1998 in Lisbon, Portugal and Co-Chair of New and Renewable Technologies for Sustainable Development, July 2000 in Madeira, Portugal. He has also participated in organizing numerous technical sessions at ASME's NHTC, InterPack, and IMECE (WAM) Conferences, as well as at IEEE, IEPS, SPIE, ITHERM, Eurotherm, ICHMT, and other international Conferences and Workshops in Europe and Asia. In 1993 he was invited by the UN to lecture and consult to the electronics industry in India.

In 1998 he was elected to the Scientific Council of the International Center for Heat and Mass Transfer (ICHMT), headquartered in Turkey. Prof. Bar-Cohen currently serves on the Steering Committee of the ASME Nanotechnology Institute and is Chair of the US Scientific Committee of the International Heat Transfer Assembly (1998-2002). Prof. Bar-Cohen is co-author (with A.D. Kraus) of Design and Analysis of Heat Sinks (1995) and Thermal Analysis and Control of Electronic Equipment (1983) and has co-edited nine books in this field, including the ASME Press Series Advances in Thermal Modeling of Electronic Components and Systems and the John Wiley & Sons Series in Thermal Management of Microelectronic and Electronic Systems. He has authored and co-authored some 75 Journal papers, 115 Refereed Proceedings papers, and 32 chapters in books, and has delivered 40 keynote, plenary, and invited lectures at major technical Conferences and Institutions.

William Maltz

Mr. Maltz is the President and Founder of Electronic Cooling Solutions Inc. (ecooling.com), one of the premiere thermal management consulting companies in the electronics industry, and has over 20 years of experience working on and solving thermal management problems for electronics companies. During his 12 years of consulting, Mr. Maltz provided thermal management expertise to companies that include: Compaq Computers, Hewlett-Packard, Intel, Brocade Communications, Cisco Systems, Apple Computer, Network Appliance, Nokia, Panasonic Avionics, and Siemens Medical.

Prior to starting ECS, Bill worked as a thermal engineer for Tandem Computers and the Amdahl Corporation. He is very active in the electronics cooling community and is a member of the program committees for the Semiconductor Thermal Measurement, Modeling, and Management Symposium (Semi-Therm) and the International Microelectronics And Packaging Society (IMAPS) Advanced Technical Workshop on Thermal Management. He has also participated in technical sessions for Semi-Therm, the IMAPS Advanced Technical Workshop on Thermal Management, and the ASME InterPACK Conference and has played an active role in the I-Therm Conference, American Society of Heating, Refrigerating, and Air Conditioning Engineers (ASHRAE). Bill has also served as an expert witness. Mr. Maltz received a Bachelors of Science Degree in Mechanical Engineering from San Jose State University.

Dr. Cathy Biber

As the founder/principal for Biber Thermal Designs (www.biberthermal.com), Dr. Biber focuses on helping mechanical engineering teams design thermal solutions that satisfy complex design requirements, particularly those using optical display technology and are end-user or "complete" products. This includes industrial design, safety, EMI, acoustic noise, manufacturability and service.

Prior to starting her consulting firm, Dr. Biber spent several years at InFocus where she worked with product design teams to solve optical and electronic cooling issues in advanced digital data/video projection systems. Previously, she was at Wakefield Engineering, where she was involved in the design, analysis and optimization of high performance heat sinks. She received her engineering degrees from MIT (PhD, MS and BS Mechanical Engineering). She is fluent in German and French, and teaches seminars on electronics cooling and related subjects throughout the U.S. and in Europe, and holds several patents. She is also an active committee member of IEEE and Semi-Therm conferences. Cathy lives in Portland, Oregon.

David Saums

Mr. Saums brings 27 years of practical research, market development, product development and product management experience in electronics thermal management associated with components, systems and materials. He is the founder of a business development and strategy-consulting firm called DS&A (dsa-thermal.com), that focuses on advanced thermal materials, components and systems for electronic systems and semiconductor packaging. His client firms are Fortune 50 electronics manufacturing companies, advanced materials manufacturers and component manufacturers in North America, Europe and Japan.

From 1978 – 1997, he was with Wakefield Engineering (formerly EG&G) where he held a range of program management and marketing related roles, including considerable product development for microprocessor and ASIC markets. After Wakefield, he has held several senior marketing roles. At Henkel Loctite (formerly Power Devices) he was Director, Marketing. He later served as VP Marketing for CPS Technologies - a manufacturer of processor and ASIC lids and other extremely high thermal conductivity materials and composites for high flux density semiconductor package components. He graduated from Clarkson University with a BS, Industrial Management and Industrial Economics in 1977, and a year later received his MBA. He also did post-graduate work at Union College (1978-81).